SUPPORT AND SOLUTION
Items for Electronics：By process
Device
- ・Epoxy resin
- ・Urethane resin
Surface mounting Process
- ・Chip Adhesive/ Corner bonds
- ・Joint Tape (splicing tape)
- ・Magazine Stick
- ・High-thermal-conductivity epoxy resin
- ・High-temperature-resistant epoxy resin
- ・Under fill
After surface mounting process
- ・UV curing type conformal coating
- ・Solvent type insulating moisture
Assembly process
- ・Potting material
- ・Low temperature epoxy bond
- ・Magazine Stick
Conveyance process
- ・Magazine Stick